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Typical specifications of Quartz Wafers
Parameter | 3-inch wafer | 4-inch wafer |
---|---|---|
Diameter [ mm ] | 76.2 ± 0.2 | 100.0 ± 0.2 |
Thickness [ µm ] | standard 500 or 350 or customer specified | |
Cut angle | family of ST-cuts with tolerance ±5' | |
LTV [ µm ] | better then 3 on the mesh 10 x 10 mm | |
Bow [ µm ] | better then 40 | |
Polished surface | SAW-quality, rms better then 0.5 nm | |
X-axis marking | by the flat ( see drawing ) or customer specified |
- Quality grade: | Grade C ( > 1.8 x 106 ) | |
- Inclusion density: | Grade Ib | |
- Etch channel density: | Grade 3 |
Typical specifications of Lithium Niobate Wafers
Parameter | 3-inch wafer | 4-inch wafer |
---|---|---|
Diameter [ mm ] | 76.2 ± 0.2 | 100.0 ± 0.2 |
Thickness [ µm ] | standard 500 or 350 or customer specified | |
Cut angle | Y, Y 41°, Y 64°, Y 127.86° etc. with tolerance ±18' | |
LTV [ µm ] | better then 5 on the mesh 10 x 10 mm | |
Bow [ µm ] | better then 40 | |
Polished surface | SAW-quality, rms better then 0.7 nm | |
X-axis marking | by the flat ( see drawing ) or customer specified |
3" wafer | ![]() |
4" wafer | ![]() |